Transient liquid phase diffusion bonding of 6061-15 wt% SiCp in argon environment

摘要: Abstract Extruded 6061-15 wt% SiCp composite was joined by transient liquid phase diffusion (TLPD) bonding process in argon environment using 50-μm thick copper foil interlayer. The carried out at 560 °C with two different applied pressures (0.1 and 0.2 MPa) five holding times (20 min, 1, 2, 3 6 h). Kinetics of the significantly accelerated presence reinforcement (SiC). This acceleration is attributed to increased solute diffusivity through defect-rich SiC particle/matrix interface porosity. Adequate bond strength (90% original strength) achieved for 0.2 MPa pressure 6 h holding. very close reported highest (92% joining aluminium-based metal matrix TLPD vacuum followed isostatic pressing. rejection oxide periphery on completion isothermal solidification, elimination void solid state higher (0.2 MPa) were main reasons achieving high strength.