3d-coaxial memory construction and method of making

摘要: A semiconductor memory in which integrated circuit chips each containing flip-flop elements are mounted to respective ones of a plurality batch-fabricated, pressurestacked electrically conductive wafers so as form compact, essentially all metal, three-dimensional structure. Coaxially-shielded X, Y and Z conductors formed the ny selective chemical etching for expeditiously providing interconnections required accordance with desired organization.