Wafer-level integration of NiTi shape memory alloy on silicon using Au–Si eutectic bonding
作者： Henrik Gradin , Sobia Bushra , Stefan Braun , Göran Stemme , Wouter van der Wijngaart
DOI: 10.1088/0960-1317/23/1/015008
关键词:
摘要: This paper reports on the wafer level integration of NiTi shape memory alloy (SMA) sheets with silicon substrates through Au-Si eutectic bonding. Different bond parameters, such as Au layer thickne ...
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