Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
作者： Xin Li , Gang Chen , Xu Chen , Guo‐Quan Lu , Lei Wang
DOI: 10.1108/09540911211214695
关键词:
摘要: … The purpose of this paper is to evaluate the mechanical properties of nano‐silver paste sintered lap shear structures and to discuss the effects of loading rate and ambient temperature …
emeraldinsight.com参考文章(20)
Sunit Rane, Vijaya Puri, Dinesh Amalnerkar, A study on sintering and microstructure development of fritless silver thick film conductors Journal of Materials Science: Materials in Electronics. ,vol. 11, pp. 667- 674 ,(2000) , 10.1023/A:1008914424013
Chia-Ruey Chang, Jau-Ho Jean, Effects of Silver‐Paste Formulation on Camber Development during the Cofiring of a Silver‐Based, Low‐Temperature‐Cofired Ceramic Package Journal of the American Ceramic Society. ,vol. 81, pp. 2805- 2814 ,(2005) , 10.1111/J.1151-2916.1998.TB02700.X
S. Strehle, S. Menzel, K. Wetzig, J.W. Bartha, Microstructure of electroplated Cu(Ag) alloy thin films Thin Solid Films. ,vol. 519, pp. 3522- 3529 ,(2011) , 10.1016/J.TSF.2011.01.236
Guo-Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata, John G. Bai, Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology. pp. 247- 256 ,(2003) , 10.1115/IMECE2003-41993
Xu Chen, Rong Li, Kun Qi, Guo-Quan Lu, Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste Journal of Electronic Materials. ,vol. 37, pp. 1574- 1579 ,(2008) , 10.1007/S11664-008-0516-2
Tao Wang, Gang Chen, Yanping Wang, Xu Chen, Guo-quan Lu, Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 527, pp. 6714- 6722 ,(2010) , 10.1016/J.MSEA.2010.07.012
Guo‐Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata, John G. Bai, Strategies for improving the reliability of solder joints on power semiconductor devices Soldering & Surface Mount Technology. ,vol. 16, pp. 27- 40 ,(2004) , 10.1108/09540910410537309
Shuji Nakamura, Masayuki Senoh, Takashi Mukai, High‐power InGaN/GaN double‐heterostructure violet light emitting diodes Applied Physics Letters. ,vol. 62, pp. 2390- 2392 ,(1993) , 10.1063/1.109374
Hui Shun Chin, Kuan Yew Cheong, Ahmad Badri Ismail, A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices Metallurgical and Materials Transactions B. ,vol. 41, pp. 824- 832 ,(2010) , 10.1007/S11663-010-9365-5
Zengmin Shi, Kai Liu, Maoqiu Wang, Jie Shi, Han Dong, Jian Pu, Bo Chi, Yisheng Zhang, Jian Li, Thermo-mechanical properties of ultra high strength steel 22SiMn2TiB at elevated temperature Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 528, pp. 3681- 3688 ,(2011) , 10.1016/J.MSEA.2011.01.053