Substrate package with through holes for high speed I/O flex cable
作者： Sanka Ganesan , Mark Hlad , Chandrashekhar Ramaswamy , Charan Gurumurthy
DOI:
关键词:
摘要: An assembly of substrate packages interconnected with flex cables and a method fabrication the package. The allows input/output (I/O) signals to be speedily transmitted between via cable without being routed through motherboard. Embodiments relate package providing separable inter-package connection. Hermetically-sealed guiding holes are provided on as mechanical alignment feature guide connection high speed I/O contact pads simultaneously forming hermetically-sealed pads.
lens.org 参考文章(28)
Para Segaram, Joseph C. Fjelstad, Thomas Obenhuber, Gary Yasumura, System for making high-speed connections to board-mounted modules ,(2004)
Tadahiko Yokota, Shigeo Nakamura, Film for circuit board ,(2004)
Para K. Segaram, Joseph C. Fjelstad, William F. Wiedemann, Kevin P. Grundy, Gary Yasumura, Signal-segregating connector system ,(2005)
Geoff A Fuller, Philip Andrew Anslow, Ing. Joan Tourne, High density printed wiring board having in-via surface mounting, pads ,(1999)
Muraleedhara Navada, Pascal C. H. Meier, Sanjay Dabral, High speed active flex cable link ,(2005)
Para K. Segaram, Joseph C. Fjelstad, William F. Wiedemann, Kevin P. Grundy, Gary Yasumura, High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture ,(2005)
Teruhisa Hayashi, Kouki Ogawa, Yasutake Hotta, Printed wiring substrate and method for fabricating the same ,(2001)
Joseph C. Fjelstad, William F. Wiedemann, Kevin P. Grundy, Stair step printed circuit board structures for high speed signal transmissions ,(2004)
Takeshi Kawabata, Masatoshi Shinagawa, Semiconductor device, and inspection method thereof ,(2006)
Tomohiro Kawase, Shinji Tachibana, Toshihisa Isono, Naoyuki Omura, Copper electroplating bath ,(2007)