Method, apparatus, and system for cooling electronic components
作者： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal
DOI:
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摘要: An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure the housed therein. In one embodiment a self-contained, stand-alone unit. another connected remote device. several of arranged in parallel controlled balance optimize efficiency among apparatus.
lens.org 参考文章(9)
Richard C. Chu, Gregory M. Chrysler, Robert E. Simons, Sub-dew point cooling of electronic systems ,(1999)
Michael A. Flores, Andrew G. Low, Peter A. Massacesi, Built-in cooling system for an enclosure ,(1995)
Edward K. Feeney, Modular floor sub-structure for the operational support of computer systems. ,(1994)
Morishige Kinjo, Akimitsu Ohmori, Electronic equipment having integrated circuit device and temperature sensor ,(1993)
Akihiro Fujimoto, Test head cooling system ,(1997)
Stephen John Palaszewski, Gary Dean Bainbridge, Quang Duong, Chandrakant B. Patel, Carla Betro, Mayankkumar M. Dixit, Mahesh B. Mistry, Cooling system for stand-alone battery cabinets ,(1997)
Dennis M. Pfister, Howard L. Davidson, Charles Byrd, Refrigeration system for electronic components having environmental isolation ,(2001)
Gerald L. Forbes, Paul Trudeau, Integrated test cell cooling system ,(1999)
Gustavo A. Chavez, Chandrakant D. Patel, Abdlmonem H. Beitelmal, Guy Wagner, Apparatus and method for air-cooling an electronic assembly ,(1998)