A phase-field study on the formation of the intermetallic Al2Au phase in the Al–Au system
作者： Fei Wang , Britta Nestler
DOI: 10.1016/J.ACTAMAT.2015.05.002
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摘要: Abstract The growth mechanism of the intermetallic Al 2 Au phase in Al–Au system during process soldering is investigated by a multiphase phase-field model. With aid assessed thermodynamic data (Li et al., 2004), binary diagram reconstructed assuming regular solution model for phase. simulation setup composed placing an Al-liquid droplet on top Au-solid substrate. To capture boundary evolution and substrate interface with respect to surrounding vacuum phase, extended ternary at one particular temperature between melting points Au. Due diffusion droplet/substrate interface, formed. In simulations, we investigate lateral vertical velocities as function surface energy liquid–intermetallic. Further, instability liquid(Al)–solid(Au) analyzed examining shrinking speed liquid–solid affected diffusivity
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