Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
作者： Shojiro Kodai , Katsunori Ochi , Fumiaki Baba
DOI:
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摘要: A method for manufacturing an integrated circuit card by providing a board having electronic components mounted thereon intermediate the thickness of molded frame and filling with resin in mold so that passes through opening seals both sides to no greater than thickness.
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