摘要: This article reviews the development of uncooled infrared focal plane array (UIFPA) imaging in China past decade. Sensors based on optical or electrical read-out mechanism were developed but latter dominates market. In resistive bolometers, VOx and amorphous silicon are still two major thermal-sensing materials. The specifications IRFPA made by different manufactures collected compared. Currently more than five Chinese companies institutions design fabricate array. Some devices have sensitivity as high 30 mK; largest for commercial products is 640×512 smallest pixel size 17 μm. Emphasis given MEMS design, ROIC fabrication, packaging manufactured GWIC, especially sensitivities, low noise, better uniformity linearity, stabilization whole working temperature range, full-digital etc.
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