Heat dissipating wiring board and method for manufacturing same
作者： Tetsuya Tsumura , Etsuo Tsujimoto , Hiroharu Nishiyama
DOI:
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摘要: A heat dissipating wiring board is provided with a metal whereupon circuit pattern formed; filler containing resin layer wherein the embedded to have upper surface of exposed from surface; and plate arranged on lower layer. The formed by penetrating groove board, composed fine opened at an extending which extends end portion board. has improved reliability against electrical insulation due dusts like in gap groove.
lens.org 参考文章(11)
Chien-Ping Huang, Leadless image sensor package structure and method for making the same ,(2000)
Saravuth Sirinorakul, Somchai Nondhasitthichai, Arlene V. Layson, Yee Heong Chua, Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound ,(2005)
Hiroyuki Handa, Seiichi Nakatani, Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same ,(2001)
Thomas P. Glenn, Plastic integrated circuit package and method and leadframe for making the package ,(1999)
Naoki Miyanagi, Yoshinari Nagano, Yoshiaki Shimomura, Shigeyuki Sakurai, Nobuhiko Tada, Shinya Okumura, Lead frame manufacturing method. ,(1993)
Seiichi Nakatani, Hiroyuki Handa, 誠一 中谷, 浩之 半田, Sheetlike substance for heat conductive substrate, its manufacture, heat conductive substrate using it and its manufacture ,(1997)
武文 水島, Takefumi Mizushima, Susumu Kajita, 進 梶田, Heat conducting board and its manufacturing method ,(2000)
Yamamoto Hajime, Furuyama Shizuo, Tsumura Tetsuya, Tanaka Shinya, MANUFACTURING METHOD OF HEAT CONDUCTIVE SUBSTRATE ,(2003)
Ushinagare Masamichi, MANUFACTURE OF SEMICONDUCTOR PACKAGE SEALED WITH LOW MELTING POINT GLASS ,(1992)
Kazuo Shimizu, Akiro Hoshi, Toshiharu Takahashi, Lead frame for semiconductor device ,(1990)