摘要: An important step in today's integrated circuit (IC) manufacturing is optical proximity correction (OPC). While OPC increases the fidelity of pattern transfer to wafer, it also significantly IC layout file size. This has undesirable side effect increasing storage, processing, and I.O. times for subsequent steps mask preparation. In this paper, we propose two techniques compressing data, including layout, while remaining compliant with existing industry standard formats such as OASIS GDSII. Our approach eliminate redundancies representation geometrical data by finding repeating groups geometries between multiple cells within a cell. We refer former ldquointercell subcell detection (InterSCD)rdquo latter ldquointracell (IntraSCD).rdquo show both problems be nondeterministic polynomial time hard (NP-hard), sets heuristics solve them. For fast compression method based on IntraSCD which utilizes hierarchical information pre-OPC data. that can effective reconstructing hierarchy from flattened demonstrate results our proposed algorithms actual layouts 90-nm, 130-nm, 180-nm feature size designs.