Extraction of systematic defects
作者： Chih-Ming Ke , Tsai-Sheng Gau , Hua-Tai Lin , Te-Chih Huang , Jia-Rui Hu
DOI:
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摘要: In one embodiment, a method for extracting systematic defects is provided. The includes inspecting wafer outside process window to obtain inspection data, defining defect pattern from the filtering design data using search defined within inside with greater sensitivity than window, and determining window. A computer readable storage medium, system are also
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