Carrier for substrate film

摘要: The invention relates to a carrier for supporting substrate film during the chip-substrate assembly and bonding process. provides enhanced rigidity film. degree of and/or flexibility provided can be controlled by selection dimensions, configuration material choice. Advantages embodiments include easier handling, reduced probability defective end products, increased control in choosing thinness For example, used lead-over-chip (LOC) assemblies lead-under-chip (LUC) create ball grid arrays (BGA), pin (PGA), dual in-line packages (DIP), like.