High performance amine based no-flow underfill materials for flip chip applications

摘要: Amine-based no-flow underfill materials and a method to produce flip-chip devices electrically bonded substrate are described. The material includes an amine-based curing agent fluxing agent, which activates at temperature is neutral the temperatures lower than temperature. of heated activation generates reactive acid in-situ during chip attachment process facilitate joint formation. formed on substrate. A placed increased activate agent. further form conductive joints between Further, cured. may be lead-free.