Mechanical and thermal behavior of polyamide-6/clay nanocomposite using continuum-based micromechanical modeling

摘要: The mechanical and thermal behaviors of polyamide-6/clay nanocomposites were studied using the continuum-based, micromechanical models such as Mori-Tanaka, Halpin-Tsai shear lag. Mechanic-based model prediction provides a better understanding regarding dependence nanocomposites’ reinforcement efficiency on conventional filler structural parameters aspect ratio (α), orientation (S), weight fraction (ψ f ), filler/matrix stiffness (E /E m ). For an intercalated exfoliated nanocomposite, effective, filler-based, that includes effective parameters, number platelets per stack (n) silicate inter-layer spacing (d 001), is proposed to describe mesoscopic nanoscopic filler. nicely captures experimental modulus for both nanocomposites. In addition, heat distortion temperature examined with different ratio. predicted appears be reasonable compared obtained by tests. Based results prediction, resistance definitely depend (α,S, ψ ,E ) (n,d 001) parameters.