Palladium-containing plating solution and its uses
作者： Yu Ling Kao , Len Tang Tsai , Min Hon Rei , Shih Chung Chen
DOI:
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摘要: A palladium-containing electroplating solution and method for providing a palladium or alloy membrane on porous metal support are provided. The subject invention uses to manufacture with decreased preparation time simplified procedure. Moreover, the prepared by exhibits excellent compactness good resistance hydrogen embrittlement, as well high applicability.
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