Electronic component mounting system and electronic component mounting method
作者： Hideki Eifuku , Tadahiko Sakai , Koji Motomura
DOI:
关键词:
摘要: Provided are an electronic component mounting system and method, by which the space occupied equipment cost can be reduced a high connection reliability ensured. An (1) includes solder printing apparatus (M1), coating/inspecting (M2), (M3), bonding material supplying/substrate (M4) reflow (M5), mounts on main substrate (4) connects module (5) to substrate. A cream is printed so as mount component, wherein particles contained in thermosetting resin supplied first connecting portion of (4), second landed with therebetween. Then, carried into (M5) heated same step bond solder, bonded together material.
lens.org 参考文章(16)
Kenneth J. Kledzik, Jason C. Engle, Electronic module having a three dimensional array of carrier-mounted integrated circuit packages ,(2001)
Nobuaki Ogawa, Yoshihiko Nishizawa, Hybrid multilayer substrate and method for manufacturing the same ,(2007)
Doo Hwan Lee, Jin Seon Park, Jung Soo Byun, Sang Chul Lee, Embedded printed circuit board and method of manufacturing the same ,(2011)
Hideki Matsushita Electric Industrial Co. Ltd. Eifuku, Mitsuru Matsushita Electric Industrial Co. Ltd. Ozono, Tadahiko Matsushita Electric Industrial Co. Ltd. Sakai, Electronic component soldering structure and electronic component soldering method ,(2006)
Masahiro Sunohara, Interposer mounted wiring board and electronic component device ,(2010)
Akira Kimura, Atsushi Saito, Katsuhiko Ohno, Component mounting apparatus, mounting-component producing method, and conveyor apparatus ,(2009)
Raymond C. Jodoin, Decoupled integrated circuit package ,(1984)
Hideki Eifuku, Tadahiko Sakai, Connecting method of electronic component ,(2007)
Patricia Louise Jones, John W. McHugh, Carrier system for integrated circuit carrier assemblies ,(1996)
Yuuji Minota, Yasuhiro Fakutomi, Motonobu Koike, Printed circuit board and method of producing the same ,(2008)