Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging
作者： Z.W. Zhong , T.Y. Tee , J‐E. Luan
DOI: 10.1108/13565360710779154
关键词:
摘要: … Because more microelectronic products are required to be environment friendly, research on lead‐free solder has become an urgent task for the microelectronics packaging industry (…
emeraldinsight.com 
researchgate.net 参考文章(95)
Laura Frisk, Kati Kokko, The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints Soldering & Surface Mount Technology. ,vol. 18, pp. 28- 37 ,(2006) , 10.1108/09540910610717884
Z.W. Zhong, H.M. Ho, Y.C. Tan, W.C. Tan, H.M. Goh, B.H. Toh, J. Tan, Study of factors affecting the hardness of ball bonds in copper wire bonding Microelectronic Engineering. ,vol. 84, pp. 368- 374 ,(2007) , 10.1016/J.MEE.2006.11.003
Jean-François Eloy, Michel Depeyrot, Nanometer range: A new theoretical challenge for microelectronics and optoelectronics Microelectronics Journal. ,vol. 37, pp. 630- 634 ,(2006) , 10.1016/J.MEJO.2005.09.006
Petteri Palm, Jarmo Määttänen, Yannick De Maquillé, Alain Picault, Jan Vanfleteren, Björn Vandecasteele, Comparison of different flex materials in high density flip chip on flex applications Microelectronics Reliability. ,vol. 43, pp. 445- 451 ,(2003) , 10.1016/S0026-2714(02)00273-1
Richard Ciocci, Michael Pecht, Learning from the migration to lead‐free solder Soldering & Surface Mount Technology. ,vol. 18, pp. 14- 18 ,(2006) , 10.1108/09540910610685394
Teck Joo Goh, Chia‐Pin Chiu, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, Test chip and substrate design for flip chip microelectronic package thermal measurements Microelectronics International. ,vol. 23, pp. 3- 10 ,(2006) , 10.1108/13565360610669959
T. Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, High-temperature reliability of Flip Chip assemblies Microelectronics Reliability. ,vol. 46, pp. 144- 154 ,(2006) , 10.1016/J.MICROREL.2005.06.004
Johann Helneder, Charlotte Hoyler, Manfred Schneegans, Holger Torwesten, Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip applications Microelectronic Engineering. ,vol. 82, pp. 581- 586 ,(2005) , 10.1016/J.MEE.2005.07.072
Laura Frisk, Anne Cumini, Reliability of ACA bonded flip chip joints on LCP and PI substrates Soldering & Surface Mount Technology. ,vol. 18, pp. 12- 20 ,(2006) , 10.1108/09540910610717866
Todd Castello, Dan Rooney, Dongkai Shangguan, Failure analysis techniques for lead‐free solder joints Soldering & Surface Mount Technology. ,vol. 18, pp. 21- 27 ,(2006) , 10.1108/09540910610717875