作者: J TONG , R SHIRAI , Y KASHIMA , Y MATSUMURA
DOI: 10.1016/J.MEMSCI.2005.03.039
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摘要: Abstract A pinhole-free palladium membrane with a thickness of 3 μm has been prepared on the surface porous sintered stainless steel tube coated thin silver layer as diffusion barrier. Filling aluminum hydroxide gel in pores is effective preventing defect formation during electroless plating layer, while volume beneath decreases greatly upon thermal treatment up to 500 °C. The hydrogen flux at 400–500 °C reasonably proportional pressure difference between two sides membrane. Addition 2 μm Pd0.8Ag0.2 alloy by electroplating does not decrease permeability.