Polyarylene sulfide resin composition

摘要: Disclosed is a polyarylene sulfide resin composition which, useful in applications such as injection molded electronic components (in particular connectors), has reduced chlorine content, results few burrs during molding and high fluidity, highly resistant to heat treatment under high-temperature conditions, capable of being at low mold temperatures; also, products said having an extremely changes surface color before after reflow soldering. The disclosed total content 950 ppm or less, formed by mixing, for every 100 parts weight (A) with 500-2000 melt viscosity 10-200 Pas (310C, shear rate 1200sec-1), 10-100 (B) liquid crystalline polyester amide 5-25 per (C) glass fibers nitrogen 100ppm less.