Electroplastic effect in copper subjected to low density electric current
作者： V.L.A. Silveira , M.F.S. Porto , W.A. Mannheimer
DOI: 10.1016/0036-9748(81)90284-2
关键词:
摘要:
elsevier.com
sci-hub.se 参考文章(2)
K. Okazaki, M. Kagawa, H. Conrad, An evaluation of the contributions of skin, pinch and heating effects to the electroplastic effect in titatnium Materials Science and Engineering. ,vol. 45, pp. 109- 116 ,(1980) , 10.1016/0025-5416(80)90216-5
D. J. Lloyd, J. D. Embury, Stress Relaxation Testing and the Determination of the Internal Stress Physica Status Solidi B-basic Solid State Physics. ,vol. 43, pp. 393- 399 ,(1971) , 10.1002/PSSB.2220430141