In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis
作者： Quan Zhou , Tae-Kyu Lee , Thomas R. Bieler
DOI: 10.1016/J.MSEA.2020.140584
关键词:
摘要: … In the present work, non-destructive high energy-X-ray diffraction measurements were … to x-ray measurements, indicating that most of the orientations in the x-ray measurements were …
sci-hub.st 参考文章(35)
J.C.E. Mertens, A. Kirubanandham, N. Chawla, Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD) Acta Materialia. ,vol. 102, pp. 220- 230 ,(2016) , 10.1016/J.ACTAMAT.2015.08.073
Huili Xu, Tae-Kyu Lee, Choong-Un Kim, Grain structure evolution and its impact on the fatigue reliability of lead-free solder joints in BGA packaging assembly electronic components and technology conference. pp. 740- 747 ,(2013) , 10.1109/ECTC.2013.6575655
Thomas R. Bieler, Leyun Wang, Armand J. Beaudoin, Peter Kenesei, Ulrich Lienert, In Situ Characterization of Twin Nucleation in Pure Ti Using 3D-XRD Metallurgical and Materials Transactions A. ,vol. 45, pp. 109- 122 ,(2014) , 10.1007/S11661-013-2082-3
Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee, Kuo-Chuan Liu, In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders Journal of Electronic Materials. ,vol. 41, pp. 262- 272 ,(2012) , 10.1007/S11664-011-1785-8
J. G. Lee, F. Guo, S. Choi, K. N. Subramanian, T. R. Bieler, J. P. Lucas, Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints Journal of Electronic Materials. ,vol. 31, pp. 946- 952 ,(2002) , 10.1007/S11664-002-0188-2
Liang Zhang, Lei Sun, Yong-huan Guo, Cheng-wen He, Reliability of lead-free solder joints in CSP device under thermal cycling Journal of Materials Science: Materials in Electronics. ,vol. 25, pp. 1209- 1213 ,(2014) , 10.1007/S10854-014-1711-Y
Donald W. Henderson, James J. Woods, Timothy A. Gosselin, Jay Bartelo, David E. King, T.M. Korhonen, M.A. Korhonen, L.P. Lehman, E.J. Cotts, Sung K. Kang, Paul Lauro, Da-Yuan Shih, Charles Goldsmith, Karl J. Puttlitz, The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue Journal of Materials Research. ,vol. 19, pp. 1608- 1612 ,(2004) , 10.1557/JMR.2004.0222
I. Dutta, D. Pan, R.A. Marks, S.G. Jadhav, Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders Materials Science and Engineering: A. ,vol. 410-411, pp. 48- 52 ,(2005) , 10.1016/J.MSEA.2005.08.142
A.U. Telang, T.R. Bieler, A. Zamiri, F. Pourboghrat, Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint Acta Materialia. ,vol. 55, pp. 2265- 2277 ,(2007) , 10.1016/J.ACTAMAT.2006.11.023
L.P. Lehman, Y. Xing, T.R. Bieler, E.J. Cotts, Cyclic twin nucleation in tin-based solder alloys Acta Materialia. ,vol. 58, pp. 3546- 3556 ,(2010) , 10.1016/J.ACTAMAT.2010.01.030