Lead-free plastic area array BGAs and polymer stud grid arraysTM package reliability

摘要: Abstract Many packaging and original equipment manufacturers (OEMs) have initiated a program of introducing lead-free electronics. Although lead usage in the industry is relatively small, major efforts are ensuring to eliminate usage. In this context, we manufactured qualified two “green” package solutions: low-profile fine pitch ball grid array (LFBGA) polymer stud arrays (PSGATM) area packages. The primary source BGA solder balls. Lead-free alloys readily available, although there no universal drop-in replacement identified so far for plastic BGAs. One most promising purpose appears be eutectic Sn95.5Ag4Cu0.5, it involves higher processing temperature. Based on design experiment (DOE), best reflow profile has been determined used. A 8×8 mm2 LFBGA without other process or changes, JEDEC moisture level 3, with 245°C simulations, standard 1st reliability tests. An alternative PSGATM. PSGATM consists injection-molded 3D body location chip mounting studs. metallized studs, which by nature lead-free, replace balls within package. Moisture conditioning analysis was performed passed 3 as well