Magnetic inductor stacks with multilayer isolation layers

作者: Bruce B. Doris , Hariklia Deligianni , Eugene J. O'Sullivan , Naigang Wang

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摘要: A magnetic laminating structure and process includes alternating layers of a material multilayered insulating material, wherein the is intermediate adjacent comprises first layer abutting at least one additional layer, comprise different dielectric materials and/or are formed by deposition process, have cumulative thickness greater than 1 micron.

参考文章(26)
Hideki Tsuruse, Takeshi Muraki, Shigeru Utsumi, Taichi Kase, Hirofumi Fujioka, Seiji Oka, Wiring board, fabrication method of wiring board, and semiconductor device ,(2003)
Hideki Yoshikawa, Seiichirou Takahashi, Composite multilayered ceramic board and manufacturing method thereof ,(2001)
Wen-Cherng Lau, Kazumasa Yasuda, Jei-Wei Chang, High saturtion magnetization material and magnetic head fabricated therefrom ,(1997)
Charles David Paynter, Ryan David Lane, Siamak Fazelpour, Inductor embedded in a package subtrate ,(2014)
Toshimi Mizoguchi, Yukiharu Suzuki, Toshihiko Kobayashi, Multilayer laminated circuit board ,(2003)