Comparison of reliability enhancement tests for electronic equipment

摘要: Techniques for fast and effective reliability enhancement testing of electronic equipment intended use in harsh operating environments have been investigated. In particular, studies made (i) a step-stress, swept-sine on random vibration profile (with combined thermal/humidity cycling) test, (ii) variety tests utilising rapid thermal cycling tri-axis vibration. The methodology is based using established products, namely aerospace engine transient pressure units automotive management units, which considerable field data exists, to assess the effectiveness at finding relevant faults. Our principal conclusions are as follows: combining test variables more than them isolation, can lead failures very quickly provided well designed (iii) not particularly useful products type studied here.