Pulse and pulse reverse plating—Conceptual,advantages and applications
作者： M.S. Chandrasekar , Malathy Pushpavanam
DOI: 10.1016/J.ELECTACTA.2007.11.054
关键词:
摘要: … The important factor for mass transport in PC plating is pulse limiting current density (I L ). The value … The enhanced PC plating rates are mainly due to its effect on electrocrystallization. …
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