Method and device for processing soldering joint partners
作者： Harald Wittrich , Wilfred John , Wolfgang Scheel , Karl Heinz Grasmann , Volker Dipl.-Ing. Liedke
DOI:
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摘要: A method of processing members to be joined by soldering, preferably printed circuit boards equipped with electrical components, and a device for carrying out this are disclosed, the being subjected plasma treatment before soldering operation. The can alternatively separately or in relative position required …
lens.org 参考文章(4)
Richard Pescatore, Jean-Jack Boumendil, Hard-soldering continuous furnace for electronic components ,(1983)
Kim Louise Pickering, Christopher John Wort, David John Pedder, Improvements relating to soldering processes ,(1989)
Fierkens Richardus Henricus Jo, Pas Ireneus Johannes Theodorus, Process and apparatus for cleaning connection leads and the like, using vacuum reverse sputtering, before soldering operations ,(1985)
Rudolf August Herbert Heinecke, Cleaning electrical contacts ,(1982)