Transferring method, manufacturing method, device and electronic apparatus of micro-led
作者： Quanbo Zou , Zhe Wang
DOI:
关键词:
摘要: The present invention discloses a transferring method, manufacturing device and an electronics apparatus of micro-LED. method for micro-LED at wafer level comprises: temporarily bonding micro-LEDs on laser-transparent original substrate onto carrier via first layer; irradiating the with laser, to lift-off selected micro-LESs; performing partial release layer, transfer substrate; head second full receiving removing by releasing substrate.
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