Device panel with in-molded applique

摘要: A method of producing a molded assembly for at least partially encapsulating touch panel structure. The includes providing structure which has front side, reverse side and an edge extending therebetween. circuit is attached to the one device. positioned in cavity plastic injection mold hollow shutoff relative device on panel. When closed, rim portion against spaced away from so as shield containing molding environment. present invention also envisions product produced by this method. further retained devices associated with are not degraded during process. window provided Additionally, barrier material may be applied prior form seal between area