作者: Tien-Tsai Lin
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摘要: A light-emitting diode (LED) cutting method includes the following steps: (A) positioning and retaining an LED chip or epitaxial substrate on a retainer; (B) introducing liquid medium to serve as sound wave reflection layer between tool chip; (C) activating power source drive magnetostrictive piezoelectric ceramic material mounted machine by inducing volume expansion/compression that generates up-and-down piston-like movement; (D) operating of proper shape has surface which super hard micro-particles diamond, CBN, SiC are electroformed carry out reciprocal motion retained retainer into pre-cut workpiece perform breaking cutting.