Light-emitting diode cutting method and product thereof

作者: Tien-Tsai Lin

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摘要: A light-emitting diode (LED) cutting method includes the following steps: (A) positioning and retaining an LED chip or epitaxial substrate on a retainer; (B) introducing liquid medium to serve as sound wave reflection layer between tool chip; (C) activating power source drive magnetostrictive piezoelectric ceramic material mounted machine by inducing volume expansion/compression that generates up-and-down piston-like movement; (D) operating of proper shape has surface which super hard micro-particles diamond, CBN, SiC are electroformed carry out reciprocal motion retained retainer into pre-cut workpiece perform breaking cutting.

参考文章(16)
Masaru Nakamura, Wafer dividing method ,(2005)
Andrew J. Ouderkirk, Catherine A. Leatherdale, Amy S. Barnes, James A. Thielen, Dong Lu, Led package with converging extractor ,(2007)
Fumiteru Tashino, Souu Kumagai, Cutting apparatus with ultrasonic transducer ,(2008)
Paul S. Lugg, Andrew J. Ouderkirk, William D. Joseph, Olester Benson, Catherine A. Leatherdale, Process for manufacturing optical and semiconductor elements ,(2005)
Andrew J. Ouderkirk, Catherine A. Leatherdale, Dong Lu, Led package with compound converging optical element ,(2006)
Uwe Strauss, Ulrich Zehnder, Frank Kuehn, Volker Haerle, Manfred Mundbrod-Vangerow, Dominik Eisert, Radiation emitting semiconductor device ,(2001)
Paul S. Lugg, Timothy D. Fletcher, Catherine A. Leatherdale, Arrays of optical elements and method of manufacturing same ,(2005)
Andrew J. Ouderkirk, Catherine A. Leatherdale, Olester Benson, Process for manufacturing a light emitting array ,(2005)