3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology
作者： Jun-Bo Yoon , Byeong-Il Kim , Yun-Seok Choi , E. Yoon
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摘要: As a viable technological option to address today's strong demands for high-performance monolithic low-cost passive components in RF and microwave integrated circuits (ICs), new CMOS-compatible versatile thick-metal surface micromachining technology has been developed. This enables build arbitrary three-dimensional (3-D) metal microstructures on standard silicon substrate as post-IC processes at low temperature below 120/spl deg/C. Using this technology, various highly suspended 3-D have successfully demonstrated IC applications. We spiral inductors 100 /spl mu/m over the substrate, coplanar waveguides 50 complicated microcoaxial lines, which 50-/spl mu/m-suspended center signal lines surrounded by inclined ground shields of height. The performance transmission line fabricated glass evaluated achieve very attenuation 0.03 dB/mm 10 GHz with an effective dielectric constant 1.6. process variation/manufacturability, mechanical stability, package issues also discussed detail.
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sci-hub.se 参考文章(54)
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