FLEXIBLE COPPER CLAD LAMINATE HAVING EXCELLENT INSULATING PROPERTY AND HEAT DISSIPATION PROPERTY AND PRINTED CIRCUIT BOARD HAVING THE SAME
作者： Oh Dong Geun , Jeong Young , Ahn Kyung A
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摘要: PURPOSE: A flexible copper clad laminate having an excellent insulating property and radiating is provided to improve cohesive power between a diamond-like carbon (DLC) layer foil by laminating the DLC on glossy surface of through nanonitride layer, thereby being stable mechanically chemically even though thickness thin. CONSTITUTION: (10) comprises: (11) in which at least one side surface; (12) formed foil; (13) layer. printed circuit board includes bonding sheet laminated both sides sheet. The contacted
lens.org 参考文章(4)
光由 松田, Hisao Sakai, Takeo Taguchi, Sakiko Tomonaga, Atsushi Yoshioka, 咲子 朝長, 淳志 吉岡, 智浩 坂田, 丈雄 田口, 久雄 酒井, Susumu Nishikawa, 誠 土橋, Tomohiro Sakata, Mitsuyoshi Matsuda, 丞 西川, Makoto Dobashi, Surface treated electrolytic copper foil and copper clad laminate obtained by using the same ,(2012)
Kim Kab Seog, Kim Yong Mo, METHOD FOR MANUFACTURING SUBSTRATE OF CERAMICS PCB USING HIGH RATE AND HIGH DENSITY MAGNETRON SPUTTERING WAY ,(2008)
Goto Tetsuya, Ohmi Tadahiro, Wiring board and method for manufacturing the same ,(2010)
Jong-Jin Lee, Printed circuit board and method of manufacturing the same ,(2009)