Solid-state color-image sensor and process for fabricating the same
作者： Isamu Kitahiro , Taketoshi Yonezawa , Yoshiko Yasuda , Shigeru Kondo , Kazufumi Ogawa
DOI:
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摘要: In a step for bonding color filter to solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also heating, pre-curing partial curing effected irradiating rays after the and has been pressed against each other correctly aligned in device then partially-bonded removed from complete of accomplished heating. According one embodiment present invention carried out atmosphere containing oxygen so that squeezed space between may be prevented being cured subsequently simple manner. further invention, prior step, are covered protective layers films surface flaws avoided. Thus, filters can bonded chips higher degree accuracy strength mass production sensors much facilitated.
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