Overmolded semiconductor package with wirebonds for electromagnetic shielding
作者： Thomas E. Noll , Robert W. Warren , Anil K. Agarwal , Matthew S. Read , Anthony LoBianco
DOI:
关键词:
摘要: According to one exemplary embodiment, an overmolded package includes a component situated on substrate. The further overmold over the and wirebond cage substrate in overmold, where surrounds component, number of wirebonds. forms EMI shield around component. this conductive layer top surface connected cage,
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