Thin film metallic glasses as new MEMS materials

作者: S. Hata , J. Sakurai , A. Shimokohbe

DOI: 10.1109/MEMSYS.2005.1453971

关键词:

摘要: In order to apply the metallic glasses MEMS, Pd-based, Zr-based and Cu-based thin film (TFMGs) are fabricated successfully using an RF magnetron sputtering system. The TFMGs exhibit high strength elastic limit at room temperature low viscosity (under 1013 Pa.s) supercooled liquid region (SCLR). These characteristics desirable for utilization of as three dimensional (3D) micro-elastic-mechanisms. 3D microstructures realized by novel microforming methods SCLR. can be divided into two categories, namely 'deformation-heating method' 'heating-deformation method'. Using those new methods, MEMS made TFMG with shapes functions demonstrated.

参考文章(8)
Seiichi Hata, Kaiji Sato, Akira Shimokohbe, Fabrication of thin film metallic glass and its application to microactuators Device and process technologies for MEMS and microelectronics. Conference. ,vol. 3892, pp. 97- 108 ,(1999) , 10.1117/12.364504
Yoshisato Yokoyama, Takashi Fukushige, Seiichi Hata, Kazuya Masu, Akira Shimokohbe, On-Chip Variable Inductor Using Microelectromechanical Systems Technology Japanese Journal of Applied Physics. ,vol. 42, pp. 2190- 2192 ,(2003) , 10.1143/JJAP.42.2190
A. Inoue, H. Yamaguchi, T. Zhang, T. Masumoto, Al–La–Cu Amorphous Alloys with a Wide Supercooled Liquid Region Materials Transactions Jim. ,vol. 31, pp. 104- 109 ,(1990) , 10.2320/MATERTRANS1989.31.104
Takashi Fukushige, Seiichi Hata, Akira Shimokohbe, Large-output-force out-of-plane MEMS actuator array Devices and process technologies for MEMS, microelectronics, and photonics. Conference. ,vol. 5276, pp. 240- 249 ,(2004) , 10.1117/12.521842
Yongdong Liu, Seiichi Hata, Kouichi Wada, Akira Shimokohbe, Thermal, Mechanical and Electrical Properties of Pd-Based Thin-Film Metallic Glass Japanese Journal of Applied Physics. ,vol. 40, pp. 5382- 5388 ,(2001) , 10.1143/JJAP.40.5382
R.S. Payne, MEMS commercialization: ingredients for success international conference on micro electro mechanical systems. pp. 7- 10 ,(2000) , 10.1109/MEMSYS.2000.838481
Hee-Won Jeong, S. Hata, A. Shimokohbe, Microforming of three-dimensional microstructures from thin-film metallic glass IEEE\/ASME Journal of Microelectromechanical Systems. ,vol. 12, pp. 42- 52 ,(2003) , 10.1109/JMEMS.2002.807475
W.N. Sharpe, K.M. Jackson, K.J. Hemker, Z. Xie, Effect of specimen size on Young's modulus and fracture strength of polysilicon IEEE\/ASME Journal of Microelectromechanical Systems. ,vol. 10, pp. 317- 326 ,(2001) , 10.1109/84.946774