Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity
作者： K. Barmak , A. Gungor , C. Cabral , J. M. E. Harper
DOI: 10.1063/1.1589593
关键词:
摘要: The impact of 11 alloying elements, namely, Mg, Ti, In, Sn, Al, Ag, Co, Nb, and B, at two nominal concentrations 1 3 at. %, Ir W, only a concentration on the resistivity grain structure copper was investigated. films were electron beam evaporated onto thermally oxidized Si wafers had thicknesses in range 420–560 nm. Pure Cu used as controls. Isothermal anneals carried out 400 °C for 5 h; constant-heating rate treatments, with no hold temperature, done 3 °C to 650 950 °C. In all cases, annealing resulted lowering compared as-deposited state. Furthermore, higher temperature lower, postannealing, room-temperature resistivity, unless film agglomerated or showed evidence solute redissolution. Annealing also significant growth grains, except Nb- W-containing films. addition, sizes nominally ...
scitation.org
harvard.edu
aip.org 
sci-hub.se 参考文章(51)
Valerie Randle, V. Randle, The Role of the Coincidence Site Lattice in Grain Boundary Engineering ,(1996)
D. E. Laughlin, D. J. Chakrabarti, P. R. Subramanian, Phase diagrams of binary copper alloys ,(1993)
Milton Ohring, The Materials Science of Thin Films ,(1991)
C. Michaelsen, C. Gente, R. Bormann, The thermodynamics of amorphous phases in immiscible systems: The example of sputter-deposited Nb–Cu alloys Journal of Applied Physics. ,vol. 81, pp. 6024- 6030 ,(1997) , 10.1063/1.364451
Anthony D Rollett, Gregory S Rohrer, F John Humphreys, Recrystallization and Related Annealing Phenomena ,(1996)
Paul R. Besser, Ehrenfried Zschech, Werner Blum, Delrose Winter, Richard Ortega, Stewart Rose, Matt Herrick, Martin Gall, Stacye Thrasher, Mike Tiner, Brett Baker, Greg Braeckelmann, Larry Zhao, Cindy Simpson, Cristiano Capasso, Hisao Kawasaki, Elizabeth Weitzman, Microstructural characterization of inlaid copper interconnect lines Journal of Electronic Materials. ,vol. 30, pp. 320- 330 ,(2001) , 10.1007/S11664-001-0038-7
D. T. Carpenter, J. M. Rickman, K. Barmak, A methodology for automated quantitative microstructural analysis of transmission electron micrographs Journal of Applied Physics. ,vol. 84, pp. 5843- 5854 ,(1998) , 10.1063/1.368898
C. Lingk, M. E. Gross, W. L. Brown, Texture development of blanket electroplated copper films Journal of Applied Physics. ,vol. 87, pp. 2232- 2236 ,(2000) , 10.1063/1.372166
S. Vaidya, A.K. Sinha, Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films Thin Solid Films. ,vol. 75, pp. 253- 259 ,(1981) , 10.1016/0040-6090(81)90404-1
Bernard Dennis Cullity, Elements of X-ray diffraction ,(1956)