Multilayer printed wiring boards with copper filled through-holes
作者： Paul Walker , Rajwant Sidhu
DOI:
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摘要: Printed circuit boards have layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect an embodiment present invention enhances thermal characteristics printed to provide extra reliability boards. In embodiment, a broad has plurality connect patterns on different circuits broad. Here, at least is plated closed both ends 70% volume through-hole to, e.g., enhance through-hole, thereby providing board. board includes surface conductor (or cap) that directly over barrel through-hole.
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