Cooler, power conversion apparatus, and cooling system
作者： Sakata Kazuki , Shinozaki Masaru , Higashino Hiroyuki , Asai Yugo , Ipposhi Shigetoshi
DOI:
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摘要: A cooler configured to cool an electronic device includes: a refrigerant inlet portion guide from outside of casing inside the casing; outlet and metal member define flow path region in which is caused casing. The plurality opening portions cause pass therethrough; capture reduction having such shape as air bubbles, are generated through connection surface between device, so reduce bubbles cooling by when cooled.
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