Wireless chip and manufacturing method thereof

摘要: It is an object of the present invention to reduce cost a wireless chip, further, chip by enabling mass production and furthermore, provide downsized lightweight chip. A in which thin film integrated circuit peeled from glass substrate or quartz formed between first base material second provided according invention. As compared with silicon substrate, realizes downsizing, thinness, lightweight. The included at least has n-type transistor having LDD (Lightly Doped Drain) structure, p-type single drain conductive layer functioning as antenna.