Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

摘要: Purpose This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu) electrolyte solutions improve plating efficiencies through enhanced ion transportation. Design/methodology/approach The impact MS-assisted topographical properties surfaces was studied a design experiments by measuring surface roughness, which is characterised values parameter Ra as measured white light phase shifting interferometry and high-resolution scanning electron microscopy. Findings An increase in from 400 760 nm after recorded for an acoustic power 45 450 W. Roughening increased because micro-bubble cavitation energy supported direct imaging cavitation. Current thieving effect MS transducer induced low currents, leading large Cu grain frosting reduction board quality. negated trials specific placement transducer. Wavy surfaces, due waves, were also observed reduce uniformity deposit. Research limitations/implications The formation unstable transient variation topology are unwanted phenomena. Further studies needed, along with fundamental simulations, determine how effects can be reduced or prevented. Practical implications This help identify manufacturing settings required high-quality promote areas further investigation, development technique. Originality/value This quantifies changes PCB response evidence deposited artefacts effects.