Lead positioning method and device used for tab-type lead automatic inspection system

作者: Takeshi Ikegami , Hirokazu Tsuji , Kazuo Maruyama

DOI:

关键词:

摘要: A TAB-type lead automatic inspection system is provided to position with high accuracy at speed for improving reliability and productivity of inspecting. positioning method used a or processing system, comprising fixing product onto table movable in an X-axis direction two Y-axis directions parallel the mounting surface, X-axis, rotational angle θ directions, device highly rigid translation mechanism pair hinges one sheet plate microfeeding piezoelectric actuators driving axis axes direction, control means feedbacking sensing signal, each actuator, thereby X, Y speed.

参考文章(5)
Wayne A. Mulholland, Michael A. Olla, Barbara R. Mozdzen, Robert H. Bond, Steven Swendrowski, Jerry S. Cupples, Linda S. Wilson, Linn Garrison, Daniel J. Quinn, Integrated-circuit leadframe adapted for a simultaneous bonding operation. ,(1985)
Michael P. Uthe, Paul S. Bamburak, Ultrasonic wire bonding quality monitor and method ,(1987)
Mandayam A. Narasimhan, Anthony L. Adams, Virge W. McClure, Lead frame lead located for wire bonder ,(1989)
Tsutomu Mimata, Aizo Kaneda, Toshimitsu Hamada, Yasuo Nakagawa, Hisafumi Iwata, Kouji Serizawa, Keizo Matsukawa, Michio Takahashi, Tooru Mita, Hiroyuki Tanaka, Toshihiko Sakai, Koichi Sugimoto, Method of aligning and bonding tab inner leads ,(1988)