Camera device, method of manufacturing a camera device, wafer scale package
作者： Erik Harold Groot , Edwin Maria Wolterink , Aloysius Franciscus Maria Sander , Gerardus Maria Dohmen , Arjen Gerben Van Der Sijde
DOI:
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摘要: The invention relates to a camera device and method for manufacturing such device. comprises an image capturing element, lens element imaging object at the spacer means maintaining predetermined distance along main optical axis though substrate carrying wherein adhesive layer. This enables mass process parts of individual elements can be manufactured in manifold on different substrates, after which substrates are stacked, aligned joined via layers. In distances between plates wafers adjusted maintained comprising From stack devices sawn out.
google.com.tr 参考文章(39)
Makoto Ogusu, Device manufacture method ,(2004)
Kenichiro Mori, Keiko Chiba, Three-dimensional structure forming method ,(2004)
Kiyoshi Yamauchi, Takeshi Ikeda, Optical link device ,(2003)
Wolfgang Gramann, Ralf Dietrich, Werner Spaeth, Georg Bogner, Optoelectronic transducer formed of a semiconductor component and a lens system ,(1996)
Hiroichi Sokei, Atsumu Iguchi, Kunio Niwa, Masahiko Kadowaki, Junichiro Nakajima, Masayuki Takahashi, Akiya Izumi, Iwao Takemoto, Semiconductor device and video camera unit using it and their manufacturing method ,(1992)
Yoshihisa Negishi, Shunichi Hosaka, Hiroshi Maeda, Kazuhiro Nishida, Solid-state imaging device and method of manufacturing said solid-state imaging device ,(2006)
Shunji Murano, Kazuhiko Shirao, Kouji Miyauchi, Akira Taguchi, Image device having a spacer with image arrays disposed in holes thereof ,(1994)
Yasuhito Yuasa, Noriaki Hirota, Masahisa Maeda, Binding resin for toner, toner, and electrophotograph ,(2000)
Yasuo Suda, Semiconductor device and its manufacture method ,(2002)