作者: Koji Ito , Minoru Nakamura , Toshihiro Mori , Masanori Akita , Hiroaki Tsuruta
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摘要: There are disclosed; an active energy beam curing type conductive paste, containing a substance, and polymerizable compound, wherein cured matter, obtained when composition of the paste excluding substance is with electron having acceleration voltage 150 kV irradiated dose 40 kGy, has internal stress 5 to 50 Mpa; production method device for conductor circuit substrate using paste; non-contact ID ID.