Interposer having a defined through via pattern
作者： Chun-Lin Lu , Chia-Chun Miao , Ming-Kai Liu , Shih-Wei Liang , Kai-Chiang Wu
DOI:
关键词:
摘要: A structure includes a substrate having plurality of balls, semiconductor chip, and an interposer electrically connecting the chip. The first side, second side opposite at least one exclusion zone extending through above each ball active via from to interposer, wherein is formed outside no vias are within zone, dummy zone.
google.de 参考文章(29)
John H. Comtois, James C. Lyke, Micro-zero insertion force socket ,(2000)
Gamal Refai-Ahmed, Maxat Touzelbaev, Michael Z. Su, Bryan Black, Yizhang Yang, Stacked semiconductor chips with thermal management ,(2010)
Yung Kuan Hsiao, Rui Huang, Kang Chen, XuSheng Bao, Hin Hwa Goh, Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof ,(2011)
Jeffrey E. Brighton, Margaret Simmons-Matthews, Jeffrey Alan West, Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips ,(2011)
Chung Yu Wang, LED flip-chip package structure with dummy bumps ,(2010)
Ilyas Mohammed, Belgacem Haba, Interposer having molded low cte dielectric ,(2012)
Solomon I. Beilin, Michael Guang-Tzong Lee, Wen-chou Vincent Wang, Chip and board stress relief interposer ,(1998)
Kengo Aoya, Jeffrey A. West, Kazuaki Mawatari, Yoshikatsu Umeda, Protruding TSV tips for enhanced heat dissipation for IC devices ,(2010)
Chung Yu Wang, Double flip-chip LED package components ,(2010)
Motoharu Haga, Yasumasa Kasuya, Sadamasa Fujii, Interposer and semiconductor device ,(2006)