Metallization of Plastics by Physical Vapor Deposition Techniques
作者： C. T. Wan , K. A. Taylor , D. L. Chambers , G. T. Susi
DOI: 10.1007/978-1-4899-0735-6_6
关键词:
摘要: … polyimide composites or other moldable high temperature … A typical metallization process fOr plastic materials consists o… in the "race track" area defined by the magnetic field on the …
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sci-hub.st 参考文章(18)
K. L. Mittal, Polyimides : synthesis, characterization, and applications Plenum. ,(1984)
John L. Vossen, Thin Film Processes ,(1979)
F. S. Ohuchi, S. C. Freilich, Summary Abstract: Ti as a diffusion barrier between Cu and polyimide Journal of Vacuum Science and Technology. ,vol. 6, pp. 1004- 1006 ,(1988) , 10.1116/1.575383
FK LeGoues, BD Silverman, PS Ho, None, The microstructure of metal–polyimide interfaces Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 6, pp. 2200- 2204 ,(1988) , 10.1116/1.575011
Reinhard Glang, Leon I. Maissel, Paul P. Budenstein, Handbook of Thin Film Technology ,(1970)
R. E. Jones, H. F. Winters, L. I. Maissel, Effect of Oxygen on the rf-Sputtering Rate of SiO2 Journal of Vacuum Science and Technology. ,vol. 5, pp. 84- 87 ,(1968) , 10.1116/1.1492586
D. S. Dunn, J. L. Grant, Infrared spectroscopic study of Cr and Cu metallization of polyimide Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 7, pp. 253- 255 ,(1989) , 10.1116/1.576128
Nils Laegreid, G. K. Wehner, Sputtering Yields of Metals for Ar+ and Ne+ Ions with Energies from 50 to 600 ev Journal of Applied Physics. ,vol. 32, pp. 365- 369 ,(1961) , 10.1063/1.1736012
D. Rosenberg, G. K. Wehner, Sputtering Yields for Low Energy He+‐, Kr+‐, and Xe+‐Ion Bombardment Journal of Applied Physics. ,vol. 33, pp. 1842- 1845 ,(1962) , 10.1063/1.1728843
L. Marton, R. L. Sproull, Advances in Electronics and Electron Physics Physics Today. ,vol. 13, pp. 54- 55 ,(1960) , 10.1063/1.3056875