High power density solid-state, insulating coolant module

摘要: A high power density semiconductor module of reduced size and weight wherein a fusion element assembly for meeting electrical processing requirements is nested in hollow casing both electrically insulating operatively cooling by single fluid medium. pair conductive terminals penetrates the at opposite ends to make an path through which resides within as stack each interleaved with plural heat sink elements undergoing uniform compressive loading parameter. The insulated cooled transverse grooves assembly, one embodiment space based utilization, way finned or backing plate passaging dual function cryogen such supercritical liquid hydrogen. terrestrial aviation marine provides that ester base oil having good dielectric properties may be instead used.