Integrating optical measurement and modelling for quantitative analysis of the micromechanical load transfer in the wood-adhesive bond interphase

摘要: By combining advanced imaging tools with morphology-based numerical modelling, a methodology has been proposed to measure the wood-adhesive bond performance at micro level. Through this integration of multi-modal and multi-scale tools, provides tool understand complex interactions between wood adhesive phases microscale. Focusing all measurements modelling on matched physical specimens avoided many simplifying assumptions. Direct measurement strain development validated that model was capable representing effects cellular structure penetration. With one can analyse stress distribution patterns throughout adhesively bonded materials virtually experiment range variables like properties, species, compression levels, processing parameters, penetration patters, etc.