Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems

摘要: High-throughput assembly of miniature wafer-fabricated packages onto panel substrates provides a manufacturing framework for high-performance multi-functional displays and other large-format systems. Control circuits, light emitters, sensors, micro-components formed in high-density arrays on wafers use variety processes materials that do not easily translate to processing. Systems assembled from some or all those components can therefore exhibit combinations properties performance characteristics are difficult achieve by only. Here, we demonstrate hierarchical strategies fabricating systems using elastomer stamp micro-transfer-printing. In this work, red, green blue microscale inorganic LEDs (µILEDs) fabricated their respective native wafer then non-native intermediate silicon wafers. The wafer, populated with heterogeneous µILEDs, undergoes conventional wafer-level processes, such dielectric depositions thin-film metallization, form fan-out packages. will three µILEDs integrated within 75 µm × 35 package. We present how package be undercut micro-transfer-printed directly application substrates. print-compatible also include sharp pressure-concentrating conductor structures which allow the electrically interconnected during printing operation. functional µILED have been these techniques. report benefits packaging systems, as displays. repairing large