Apparatus and method for dicing semiconductor wafers

摘要: A wafer (64) to be diced form chips is placed on the sticky side of a thin elastic film (26) in Swiss Cross which secured members compressed but expandable square frame (2), being scribing and dicing machine (89) its released state so that thus can expand during operation, further expansion accomplished after by heating while an fixture (122) insure removal from without damaging adjacent chips. The material may rendered less formation exposure ultraviolet energy or like.