作者: Y. J. Kim , K. B. Yang , Y. S. Kim
DOI: 10.1163/156939309789932331
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摘要: A via stitching (VS)-electromagnetic bandgap (EBG) is analyzed with the compact circuit modeling method. From this analysis, a EBG structure proposed to mitigate wideband simultaneous switching noise (SSN) in mobile phones. This enough be used Simulations and measurements show that meets requirements of stopband characteristics, having range from 750 MHz 3.25 GHz –60 dB suppression.